Optomec Inc., a leading supplier of Additive Manufacturing systems, announced that one of its existing production customers recently purchased another six (6) Aerosol Jet 3D Electronics Printers, bringing its total count to 20 systems. The orders totalling more than $2 million are part of a production ramp plan that will increase to more than 30 systems over the next 12 months.
These most recent orders include the first installations of Optomec’s new HD2 printer for 3D Additive Electronics, a platform designed for inline production in advanced semiconductor packaging and PCB assembly operations. Optomec will also provide Production Recipes for both conductive and insulating materials as part of the contract.
The customer is a leading global manufacturer of aerospace and defense electronic systems, as well as other advanced technology products, with annual sales of more than $25 billion. For over 5 years, they have used Optomec’s patented Aerosol Jet 3D Printed Electronics solution.
“Optomec is fortunate that many of its customers are at the vanguard in adopting Additive Manufacturing in real-world production applications,” said. “This particular user is truly a standout in leading the charge when it comes to implementation of 3D Additive Electronics, having shipped 100,000s of products manufactured using Optomec’s Aerosol Jet solution for advanced semiconductor packaging.”
– David Ramahi, Optomec CEO
Aerosol Jet 3D Electronics Printers
The patented Aerosol Jet 3D Electronics Printers from Optomec are an Additive Electronics solution capable of directly printing high resolution conductive circuitry with feature sizes as small as 10 microns. The ability to print onto non-planar substrates and fully 3-dimensional end-parts further distinguishes the process. Direct printing of 3D Antennas, 3D Sensors, Medical Electronics, Semiconductor Packaging, and Display Assembly are examples of production applications.
Printing 3D Interconnects to connect chips to other chips, traditional circuit boards, and even directly integrated into end-products such as wearables is a primary high-value use case in Semiconductor Packaging. In this case, the process replaces legacy wire-bonding due to its advantages in terms of smaller space claim, lower loss (particularly at high frequencies and mmWave), and greater mechanical reliability.
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