Velo3D has qualified the copper-chromium-niobium alloy GRCop-42 for use in its Sapphire printer family.
Lockheed Martin’s space division has deployed Velo3D’s end-to-end additive manufacturing solution for its advanced QA capabilities
Velo3D released its Flow 3.0 Print Preparation Software which can process models of parts that are significantly larger to support the Sapphire XC’s
Velo3D, Inc. has commenced its Seeing is Believing AM Tour for 2022, scheduled to visit 15 U.S. cities.
Velo3D and Launcher Expand High-Performance Liquid Rocket Engine Component-Manufacturing Collaboration
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Launcher purchased a Velo3D metal additive manufacturing solution to print Inconel parts in April 2021 and has recently added a second one that prints Titanium.
VELO3D’s disruptive technologies, unmatched patent portfolio and deep customer relationships are driving adoption of additive manufacturing in a market that is set to expand to $35 billion in 2030.
VELO3D’s experienced management team, including founder and CEO Benny Buller and CFO Bill McCombe, will continue to lead the Company through its next phase of growth.
VELO3D, the digital manufacturing innovator, has signed an agreement with CRP Meccanica, a leader in high-precision CNC machining services with 20 years’ experience in the field of metal 3D printing technologies, for exclusive distributorship of its advanced SupportfreeTM Metal 3D printing systems in the Italian market.
The unveiling of Boom Supersonic’s XB-1 supersonic demonstrator aircraft last fall at the company’s Denver hangar has brought the dream of a return to supersonic air travel closer to reality.
VELO3D, an innovator in digital manufacturing, announced the expansion of its systems portfolio to include Sapphire XC, an “Extra Capacity” large-format 3D printer that will increase production throughput by 5X and reduce cost-per-part by up to 75%, when compared to the existing Sapphire system.
Digital manufacturing innovator VELO3D and Lam Research Corporation recently announced a joint development agreement that includes collaboration on novel materials and designs in metal additive manufacturing (AM) or 3D printing applications for the semiconductor industry.
